Ibrief introduction
Water sol ubl e pre fl uxEN-oneone0#OSP(Organic Sol derabil ity Preserzatl ve有機預焊)工藝是以化(hua)學of方法,在裸銅表面形成一(yi)層(ceng)薄膜(mo)。這層(ceng)膜(mo)具(ju)有防(fang)氧化(hua),耐熱沖(chong)擊,耐濕性。因而,在PCB制造業中,OSP工藝可替代熱風(feng)整平(ping)技(ji)術(shu)(shu)。OSP工藝生產(chan)ofPCB板具(ju)有更(geng)優良of平(ping)整度和翹曲度,更(geng)適(shi)應電子工業中SMT技(ji)術(shu)(shu)of發(fa)展要求。OSP技(ji)術(shu)(shu)正得到迅速(su)of發(fa)展。國內of公司(si)對OSP藥水(shui)of研究(jiu)也take得了(le)很大of進展。我公司(si)ofEN-oneone0#The antioxidant manufacturing process is based on the introduction of advanced Japanese technol ogy, and the cost is greatl y reduced after the l ocal ization of raw material sThe best choice for PCB manufacturers.
two、 Process fl ow and operating conditions
one、工藝流(liu)程
DegreasingEN-oneonethree#--→ secondary washing--→Micro erosionEN-oneonetwo#--→ secondary washing--→ pickl ing--→ Di washing--→EN-oneone0#Fil m forming--→ air drying--→ Di washing--→ drying
two. Operating conditions
optimum
Range
concentration
one00%
90—oneone0%
temperature
three0℃
twofive—threefive℃
Immersion time
six0sec
three0—90sec
PH
three.three
three.0—three.six
fil ter
連續fil ter,循環量three—4次/小時
Fil m thickness
0.twofive—0.threefive μM
0.two—0.five μM
三、Fil m forming厚度ofcontrol
OSP of關鍵是control 好防氧化膜(mo)(mo)of厚度(du)。膜(mo)(mo)太薄(bo),耐熱沖擊(ji)能力差,在過回(hui)流焊時膜(mo)(mo)層耐不住高(gao)溫(one90-000C),最(zui)終影(ying)響(xiang)焊接(jie)性能(neng)(neng);膜(mo)太厚,在電子裝配線(xian)上(shang),膜(mo)不能(neng)(neng)很好(hao)of被助焊劑(ji)所溶解,影(ying)響(xiang)焊接(jie)性能(neng)(neng)。一般control Fil m thickness在0.two-0.fiveμMIt is more suitabl e between.
要得到均勻(yun)穩定ofFil m thickness,生產中應control 好(hao)以(yi)下幾方面(mian)of參數:
one、Degreasing
Degreasing效果of好壞直接影(ying)響(xiang)到Fil m forming質(zhi)量。Degreasing不(bu)良,則Fil m forming厚(hou)度不(bu)均勻。一方面(mian),可以(yi)通(tong)過分析溶液,將concentrationcontrol 在工藝(yi)Range內,另一方面(mian),也要經常檢查Degreasing效果是否好,如Degreasing效果不(bu)好,則應(ying)及時更換Degreasing液。
two、Micro erosion
Micro erosionof目of是形成粗糙(cao)of銅(tong)面,便于Fil m forming。Micro erosionof厚度直接影響到Fil m forming速(su)率,因此,要形成穩定ofFil m thickness,保持Micro erosion厚度of穩定是非(fei)常重要of。一般將(jiang)Micro erosion厚度control 在(zai)one0-one.fiveμMMore appropriate.
每班生產前,可測定Micro erosion速(su)(su)率,根據Micro erosion速(su)(su)率來確定Micro erosion時間。
three、Fil m forming
a、Working fl uidof有(you)(you)效(xiao)物(wu)concentration對Fil m forming速率(lv)有(you)(you)一定影響,盡量control Working fl uidof有(you)(you)效(xiao)物(wu)concentration穩(wen)定是重要of。
b、control Stabil ity of pH val ue (PH)three.two-three.five)。PH值of變化對Fil m forming速率影響較大。PH值越高,Fil m forming速率越快;反之,PH值越低,則Fil m forming速率越慢。
c、control Fil m forming液(ye)temperatureof穩(wen)定也(ye)是(shi)必要of。因為Fil m forming液(ye)temperatureof變化對Fil m forming速率(lv)影響比較大,temperature越高(gao),Fil m forming速率(lv)越快。
d、Fil m forming時間(jian)ofcontrol 。Fil m forming時間(jian)越(yue)(yue)長,Fil m forming厚度越(yue)(yue)大。根據(ju)實測ofFil m thickness來確定Fil m forming時間(jian)。
4、Fil m forming前of水洗最好采useDI水,以防Fil m forming液遭到污染。
five、Fil m forming后(hou)of水洗(xi)最好(hao)采useDI水,且PH值應control 在five0-seven0To prevent the fil m from being pol l uted and damaged.
4、 Detection method
one、Degreasing效(xiao)果檢測方(fang)法
一(yi)般認為,經Degreasing后,板(ban)面裸銅面在水洗后能形成水膜且在onefive秒鐘內不破裂,說明Degreasing效果良好。否則,可考慮補充或更換Degreasing劑。
two、Micro erosion速(su)率測(ce)定方法
a、takesevencm×sevencmofone.sixmm Thick doubl e-sided copper foil pl ate with an area ofS(cmtwo);
b、Put it in the oven and90-one00OC烘three0分鐘;
c、Cool it to room temperature in a moisture-proof bottl e and weigh it with an anal ytical bal anceWone(g);
d、隨(sui)生產(chan)板(ban)浸(jin)入(ru)生產(chan)線內ofDegreasing缸中(zhong),并(bing)于Micro erosion缸后take出(保證浸(jin)蝕時間(jian)跟(gen)生產(chan)板(ban)一致),Micro erosion時間(jian)記為t(minutes);
e、After washing with water, put it in the oven90-one00OC烘three0分鐘;
f、Cool it to room temperature in a moisture-proof bottl e and weigh it with an anal ytical bal anceWtwo(g);
g、cal cul ation
Copper etching rate (μ m)/分鐘)=one0000×(Wone-Wtwo)/(8.9two×two×S×t)
three、Fil m forming液有效物concentrationof測(ce)定方法
a、EN-oneone0#Stock sol utiontwo0ml ,use去(qu)離子水(shui)稀釋至five00ml ,混勻。此為標準液(ye)。
b、Working fl uidtwo0ml ,use去離(li)子水稀釋至(zhi)five00ml ,混勻。
c、In UV spectrophotometer, attwosevensixnmUse deionized water as reference and cal ibrate zero.
d、Adjust the absorbance with standard sol ution toone00,再測Working fl uidof吸光度A。
e、cal cul ation
有效物(wu)concentration(%)=A
4、Fil m forming厚(hou)度測(ce)試方(fang)法
a、Put a piecefortymm×five0mmof單(dan)面裸(luo)銅板與(yu)生(sheng)產板一起(qi)在OSP production l ine processing;
b、將已處理of板放在(zai)一干(gan)凈oftwofive0mL in beaker;
c、use移液(ye)管takefive0ml five%of鹽酸液(ye),放入燒(shao)杯,輕搖燒(shao)杯,三分(fen)鐘后將板(ban)拿出(chu);
d、usefive%of鹽酸校零,在紫外分光光度計上,于twosevensixnmMeasure absorbance at;
e、Againc步驟(zou)準備of液體(ti)(ti)更換,讀take在twosevensixnm處of吸(xi)光(guang)度A;
f、cal cul ation:
Fil m thickness(微(wei)米(mi))0.seven× A
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